ForschungPublikationen
Strategies for the Use of Hot Melt Adhesives for Highly Accurate Micro Assembly

Strategies for the Use of Hot Melt Adhesives for Highly Accurate Micro Assembly

Kategorien Konferenz (reviewed)
Jahr 2008
Autoren Rathmann, S.; Raatz, A.; Hesselbach, J.
Veröffentlicht in in: 2nd CIRP Conference on Assembly Technologies and Systems, 21-23 September 2008, Toronto, Canada, 2008
ISBN 978-0-9783187-1-0