Beschreibung
Nowadays, the production of 3D MEMS and MOEMS is carried out by using hybrid integration of single components, for which batch production is normally preferred. In this field, adhesive technology is one of the major joining techniques. In most cases viscous adhesives will be used for that. Viscous adhesives afford a wide application area for different materials parings. An alternative could be the use of hot melt adhesives. In contrast to viscous adhesive techniques hot melts allows the coating of micro components in a batch long before the joining process. Because of the short set times of hot melt adhesives, short joining times are possible. For this assembly process adapted heat management is necessary. This paper presents two heat management concepts and describes different process variants using different heat sources. The heat management concepts will be divided in a passive and an active one. The passive heat management concept uses the characteristic of heat storage in components and gripping systems. To assembly components one of the joining partners has to be heated to a special working temperature before the joining process. In contrast to the passive concept the heat source is directly implemented in the gripper or fixture system. Therefore, a uniform heat input is possible. This leads to a lower thermal stress in the micro components and allows a shorter process time of the assembly process. Disadvantage of this concept is the complex design of the gripping and fixture systems. Also the heat dissipation has to be considered. The applicability of the presented heat management concepts and of different developed gripping systems will be shown in simulations and experiments.
