Strategies for the Use of Hot Melt Adhesives for Highly Accurate Micro Assembly
| Kategorien |
Konferenz (reviewed) |
| Jahr | 2008 |
| Autorinnen/Autoren | Rathmann, S.; Raatz, A.; Hesselbach, J. |
| Veröffentlicht in | 2nd CIRP Conference on Assembly Technologies and Systems, 21-23 September 2008, Toronto, Canada, 2008 |
| ISBN | 978-0-9783187-1-0 |
