Failure Mode Based Design and Optimization of the Electrode Packaging Process for Large Scale Battery Cells

Automation Concepts and Gripping Solutions for Bonding with Reactive Multilayer Systems

Categories Konferenz (reviewed)
Year 2014
Authors Heyn, J.; Blumenthal, P.; Hemken, G.; Fiedler, S.; Walz, C.; Raatz, A.; Dröder, K.
Published in Procedia CIRP 23 (2014) pp. 13-18, (5th CIRP Conf. on Assembly Technology and Systems (CATS), Dresden, Germany)

Reactive multilayer systems (RMS) represent an innovative heat source for the establishment of solder joints. They offer fast bonding processes that introduce very little thermal input and internal stress on the bonded parts. The current application process of RMS is predominantly manual labor. There are a couple of challenges to be overcome to automate this process, a requirement for its introduction into industrial production.

In this paper we evaluate the requirements for an automated joining process with RMS and devise a concept of a modular assembly system for different product structures. Furthermore we show our results in gently and reliably gripping and handling of RMS.

ISSN 2212-8271
DOI 10.1016/j.procir.2014.03.198