ResearchPublications
Strategies for the Use of Hot Melt Adhesives for Highly Accurate Micro Assembly

Strategies for the Use of Hot Melt Adhesives for Highly Accurate Micro Assembly

Categories Conferences (reviewed)
Year 2008
Authors Rathmann, S.; Raatz, A.; Hesselbach, J.
Published In in: 2nd CIRP Conference on Assembly Technologies and Systems, 21-23 September 2008, Toronto, Canada, 2008
ISBN 978-0-9783187-1-0