Failure Mode Based Design and Optimization of the Electrode Packaging Process for Large Scale Battery Cells

Sensor-guided micro assembly of active micro systems by using a hot melt based joining technology

Categories Konferenz
Year 2008
Authors Rathmann, S.; Schöttler, K..; Berndt, M; Hemken, G.; Raatz, A.; Tutsch, R.; Böhm, S.
Published in Microsystem Technologies, 2008, Vol. 14 (12), pp. 1975-1981

This article presents (the most) recent results of the subprojects B4 and B8 of the Collaborative Research Center 516—Design and Manufacturing of Active Micro Systems—which are concerned with the assembly of active micro systems. While subproject B4 investigates sensor guided assembly processes, subproject B8 develops suitable assembly techniques on the basis of non-viscous adhesive systems (hot melts). Process development focuses on the suitability for automation, process times and the applicability of batch processes. The article discusses certain hot melt application techniques that are suitable for batch production, a sensor-guided assembly system as well as different approaches for heat conduction in an automated assembly process for hot melt coated micro components.

DOI 10.1007/s00542-008-0681-5