Failure Mode Based Design and Optimization of the Electrode Packaging Process for Large Scale Battery Cells

Process development for the assembly of microsystems with hot melt adhesives

Categories Zeitschriften/Aufsätze (reviewed)
Year 2012
Authors Raatz, A.; Rathmann, S.; Hesselbach, J.
Published in CIRP Annals - Manufacturing Technology, Elsevier B.V., 2012, Vol. 61 (1)

In the assembly of microsystems, a reliable, precise, and fast joining process remains an open challenge. An approach using hot melt adhesives to join these micro parts is investigated within this article. A relevant issue with hot melt adhesives is introducing heat into the assembly process. This heat management can be achieved using either an active or passive concept. These concepts and their influence on process design are discussed. The realization of active heat management within a gripper is discussed in detail. Experimental results from an exemplary process show the applicability of the hybrid assembly process using hot melt adhesives.

ISBN 0007-8506
DOI 10.1016/j.cirp.2012.03.104
More info