ResearchPublications
Design of a Microassembly Process Based on Hot Melt Adhesives

Design of a Microassembly Process Based on Hot Melt Adhesives

Categories Contribution to Books
Year 2011
Authors Rathmann, Sven; Ellwood, John; Raatz, Annika; Hesselbach, Jürgen
Published In in: Büttgenbach, S.; Burisch, A.; Hesselbach, J.: Design and Manufacturing of Active Microsystems, Springer, Microtechnology and MEMS series, Berlin u.a., 2011, 345-364
ISBN 978-3-642-12902-5