ForschungPublikationen
Influences on the automated assembly of hybrid Microsystems with high accuracy

Influences on the automated assembly of hybrid Microsystems with high accuracy

Kategorien Konferenz
Jahr 2007
Autoren Schöttler, K.; Hesselbach, J.; Raatz, A.
Veröffentlicht in in: Smart Systems Integration 2007, VDE Verlag, Berlin Offenbach, Paris, Frankreich, 2007, 621-624
Beschreibung

'Nowadays, an ongoing trend of miniaturization of products and components can be observed in nearly all application areas in the world. In this context, a distinction is drawn between monolithic and hybrid microsystems. The latter group requires some kind of assembly process. For the assembly of hybrid microsystems, a high assembly accuracy in the range of a few micrometers is required. In order to reach this accuracy, an assembly system for sensor guided microassembly has been developed in the Collaborative Research Centre 516 “Design and manufacturing of active micro systems”. The combination of a parallel robot with an integrated 3D vision sensor enables to reach relative positioning accuracies below one micrometer. In order to reach a high relative positioning accuracy, it is necessary to use a calibration strategy to match the coordinate system of the 3D vision sensor with the coordinate system of the robot. Positioning marks on the joining partners are used by the 3D vision sensor for object recognition. Due to the desired relative position of the parts the vision system calculates a correction vector which is used for position correction in the robot control system. For the robot control system, a real-time system with a modular control concept is used. The paper describes the design of a system for automated assembly of hybrid microsystems and the accuracies of the components. A brief description of the robot control system and the calibration strategy is given. The influences on the accuracy will be analyzed considering an example for an automated assembly process. In this process a relative positioning accuracy of 0.5 µm is reached. Due to the geometry of the assembled parts and displacements in the joining process, the assembly accuracy of the process is in the range of a few micrometers. '

ISBN 978-3-8007-3009-4