In-Process Laser Scanning Technology for Micro Assembly

In-Process Laser Scanning Technology for Micro Assembly

Kategorien Konferenz
Jahr 2007
Autoren Rathmann, S.; Raatz, A.; Schöttler, K.; Hesselbach, J.
Veröffentlicht in Proc. of 7th euspen International Conference, Bremen, 2007, pp. 340 V2-343 V2

To recognize edges of components in an assembly process, in particular of microelectronic or micro system components, nowadays vision systems are preferred. These systems are working fast but the results strongly depend on ambient conditions. In most sensor guided assembly systems laser displacement sensors are implemented additionally to vision systems. These sensors are used for detection of the components height. In this paper a scanning method is presented that detects edges by using a laser displacement sensor. These data can be used by robot assembly system for a sensor guided assembly process. Further by this technique is extended in order to gain 3D-infonnation of micro components and a proposal of the field of application is outlined.

ISBN 978-0-9553082-2-2
DOI 10.15488/13311