Sensor Guided Micro Assembly by Using Laser-Scanning Technology

Sensor Guided Micro Assembly by Using Laser-Scanning Technology

Categories Konferenz
Year 2006
Authors Rathmann, S.; Wrege, J.; Schöttler, K.; Raatz, A.; Hesselbach, J.
Published in S. Ratchev (Edt.): Precision Assembly Technologies for Mini and Micro Products, Proc. Third International Precision Assembly Seminar (IPAS'2006), Springer Verlag, Berlin, Bad Hofgastein, Austria, 2006, pp. 101-108

To recognize geometric objects of components in assembly processes, in particular of microelectronic or micro system components, nowadays the use of vision systems is preferred. These systems are working very fast but the results depend on ambient conditions, especially of light settings. They deliver 2D object information referring to the image plane of a camera. In most sensor guided assembly systems, additional to vision systems laser displacement sensors are implemented to get information about the third dimension, the components height. In this paper a scanning method is presented which enables object recognition by using a laser positioning sensor and to use the achieved measuring values for a sensor guided assembly process.

ISBN 978-0-387-31276-7
DOI 10.1007/0-387-31277-3_11