Institute of Assembly Technology and Robotics Research Publications
Laser Scanning Technology for Micro Assembly Systems

Laser Scanning Technology for Micro Assembly Systems

Categories Konferenz
Year 2006
Authors Rathmann, S.; Wrege, J.; Schöttler, K.; Raatz, A.; Hesselbach, J.
Published in Proc. First CIRP International Seminar on Assembly Systems, Stuttgart, Germany, 2006, pp. 61-66

To recognize geometric properties of components in assembly processes, in particular of microelectronic or micro system components, nowadays the use of vision systems is recommendable. These systems are working very fast but the results depend on ambient conditions, especially of light settings. They deliver 2D object information referring to the image plane of a camera. In most sensor guided assembly systems, additionally to vision systems laser displacement sensors are implemented to get information about the third dimension, the components height. In this paper a scanning method is presented which enables object recognition by using a laser positioning sensor. It will be shown that the achieved measuring values can be used for sensor guided assembly process.

ISBN 978-3-8167-7213-2